Defectivity Study for Directed Self-Assembly (DSA) Contact Hole Shrink

Electrical Via Chain Yield for DSA Contact Hole Shrink Process

In this study, we conducted electrical via chain yield tests for the purpose of verifying the total process performance of directed self-assembly (DSA) contact hole shrink process. DSA was utilized on the via level connecting between two metal levels. From the analysis of single via resistance data, the best process condition was determined and the via chain yield was obtained. The best yield w...

Triblock colloids for directed self-assembly.

Methods for functionalizing micrometer-sized colloidal spheres with three or more zones of chemical functionality (ABA or ABC) are described. To produce ABA triblock colloids, we functionalized the north pole, south pole, and equator to produce what we call X, Y, and K functionality according to the number of allowed nearest neighbors and their spatial arrangements. These synthesis methods allo...

Supporting Information for Electrostatic Self-Assembly of Polystyrene Microspheres Using Chemically-Directed Contact Electrification

Computational Study of DNA-Directed Self-Assembly of Colloids

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Combining Physical Resist Modeling and Self-Consistent Field Theory for Pattern Simulation in Directed Self-Assembly

In this presentation, we describe multi-scale modeling method combining PROLITH lithography simulation with Self-Consistent Field Theory (SCFT) computation of the block copolymer Directed SelfAssembly (DSA). Within this method, we utilize PROLITH to predict the shape of a lithographic feature as function of process conditions. The results of that calculation are then used as input into SCFT sim...